Home / Semiconductor Electronics / Global FinFET Technology Market Report 2016

Global FinFET Technology Market Report 2016

  • Id : RNR-53885
  • Category : Semiconductor Electronics
  • Publish Date : 2016
  • Pages : 0
  • Format : PDF
License Type

Description
Since the production of Metal–Oxide–Semiconductor Field-Effect Transistor (MOSFET), channel length of the device is shrinking constantly for fabricating the fast and compact devices. There is currently a huge need of compact and smaller devices; hence MOSFET is not a suitable choice for the same. FinFET technology witnessed a major increase in adoption rate for the usage in Integrated Circuits (ICs) due to several advancements in the technology such as superior levels of scalability, and advantages in terms of IC processing. The principle on which FinFET technology works is similar to that of conventional MOSFET. A major characteristic of FinFET is that the conducting channel is wrapped by a fin, which forms the body of the device. 
The FinFET technology market is estimated to reach $32.74 billion by 2022 at a CAGR of 28.6% through the forecast period. This growth in the FinFET technology market is due to the increasing IC industry which is providing ample growth opportunities to the FinFET technology market. Rising mobile and consumer electronics market and enhanced performance with lower current leakage are some of the factors driving the growth of FinFET technology market. However, designing challenges for the designers and higher wafer cost and gate cost of FinFET in comparison to FD-SOI are restraining the growth of the global FinFET technology market. 
In terms of revenue, the 22nm segment held the major share of 30% in the global FinFET technology market in 2015; whereas 10nm segment is expected to increase at the highest CAGR in the coming years. 10nm FinFET technology market is expected to generate the revenue from 2016 and is expected to grow at the highest rate in the coming years, but 7nm FinFET technology is expected to take the position of 10nm in the coming years. The landscape is complicated, because each competitor is adopting a different strategy to lead the market. Samsung is planning to ship its 10nm FinFET technology first and then focus on the 7nm FinFET technology. However, GlobalFoundries is skipping the 10nm FinFET technology and has directly started the production of 7nm FinFET technology. TSMC is also adopting the same procedure as of Samsung, wherein the company will move into 10nm production in early 2017 and 7nm shipments in 2018. TSMC believes that 10nm is a shorter node and is emphasizing more on 7nm FinFET technology.
Both 10nm and 7nm technologies are based on scaled down versions of FinFET transistors; but the exact definition of these nodes are not same and both the nodes are not alike. That is why it will be a complex decision to go with 10nm or 7nm technologies for the leading-edge foundry customers. Theoretically, 7nm FinFET technology will provide better performance than 10nm, but 10nm FinFET technology is expected to ship much sooner than 7nm. 
On the basis of applications, the global FinFET technology market is segmented into Central Processing Unit (CPU), Field-Programmable Gate Array (FPGA), Micro Control Unit (MCU), Network Processors, Graphics Processing Unit (GPU) and System on Chip (SoC). CPU segment is the highest revenue generating segment among all the applications of FinFET technology; whereas, GPU is expected to grow with the highest rate during the forecast period. FinFET technology market is used by various end users such as automotive, smart phones, wearables, computers and tablets, high-end networks, and others. Smart phones segment is the highest revenue generating segment among all the end users of FinFET technology; whereas the wearables segment is expected to grow at the highest rate during the forecast period.
The market is currently dominated by North America region and Asia Pacific is expected to grow at the highest rate of 31.8% in the coming years. The growth in the demand of high-smartphones in Asia Pacific region has driven the FinFET Technology market. Samsung is the first company to manufacture chips using this technology at 14nm process. TSMC and Samsung manufacture the A9 processor for Apple (U.S.) using FinFET Technology. China and India are going to be the key market regions for the growth of FinFET technology in Asia Pacific region because of the growing demand of high end smartphones in the market. Large number of small and big companies are investing in smartphone market and this invariably leads to an increase in the growth of FinFET Technology market in this region.
Some of the key players in the industry are Samsung Electronics Co, Ltd., Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, GlobalFoundries, United Microelectronics Corporation, Qualcomm Incorporated, ARM Ltd., SMIC, and Xilinx Inc.
FinFET technology continues to gain immense popularity with increasing rate of revenue at a global level. Rising mobile and consumer electronics market and enhanced performance with lower current leakage has led to the widespread emergence of the global FinFET technology market. The global FinFET technology market is estimated to witness growth at a CAGR of 28.6% over the period of 2016 to 2022. This growth rate is expected due to increasing Integrated Circuit (IC) industry which is providing ample growth opportunities to FinFET market. 
North America led the global FinFET technology market in 2015. Asia Pacific FinFET technology market is expected to grow with the highest rate during the forecast period and overtake the position of North America in global FinFET technology market. China and India are going to be the key market regions for the growth of FinFET Technology in Asia Pacific region because of the growing demand of high end smartphones in the market. Large number of small and big companies are investing in smartphone market and this invariably leads to an increase in the growth of FinFET Technology market in this region. 
Partnerships, joint ventures, collaborations and contracts have also emerged as preferred strategies in bringing the FinFET technology market together. The companies with identical goals are collaborating together to form joint venture programmes in order to assist each other in achieving those goals. This helps companies gain access to each other’s technologies, services and thus facilitates them to achieve their objectives faster. Some of the key players involved in this market are Samsung Electronics Co, Ltd., Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, GlobalFoundries, United Microelectronics Corporation, Qualcomm Incorporated, ARM Ltd., SMIC and Xilinx Inc. 
The report is a compilation of different segments of global FinFET technology market including a market breakdown by technology, end user, and application. The report also discusses in detail about the key participants involved in the industry.
The report answers the following questions about the global FinFET technology market:
•    What are the prevailing technologies, and end users in FinFET technology?
•    What are the different application areas of FinFET technology?
•    What are the different factors driving the market forward in the forecast period?
•    What are the factors restraining the growth of global FinFET technology market?
•    Who are the major participants in the global FinFET technology market?
•    What kind of new strategies are being adopted by the existing market players to make a stronger mark in the industry?
•    Which region will lead the global FinFET technology market by the end of forecast period?