Home / Semiconductor Electronics / Global IC Packaging Market Professional Survey Report 2016

Global IC Packaging Market Professional Survey Report 2016

  • Id : RNR-22679
  • Category : Semiconductor Electronics
  • Publish Date : 11-Oct
  • Pages : 125
  • Format : PDF
License Type

Description
Notes:
Production, means the output of IC Packaging
Revenue, means the sales value of IC Packaging

This report studies IC Packaging in Global market, especially in North America, Europe, China, Japan, Southeast Asia and India, with production, revenue, consumption, import and export in these regions, from 2011 to 2015, and forecast to 2021.

This report focuses on top manufacturers in global market, with production, price, revenue and market share for each manufacturer, covering
    ASE
    Amkor
    SPIL
    STATS ChipPac
    Powertech Technology
    J-devices
    UTAC
    JECT
    ChipMOS
    Chipbond
    KYEC
    STS Semiconductor
    Huatian
    Carsem
    Nepes
    FATC
    Walton
    Unisem
    NantongFujitsu Microelectronics
    Hana Micron
    Signetics
    LINGSEN

By types, the market can be split into
    Type I
    Type II
    Type III

By Application, the market can be split into
    CIS
    MEMS
    Others

By Regions, this report covers (we can add the regions/countries as you want)
    North America
    China
    Europe
    Southeast Asia
    Japan
    India