Global Multilayer Printed-wiring Board Market by Manufacturers, Regions, Type and Application, Forecast to 2021
- Id : RNR-44277
- Category : Semiconductor Electronics
- Publish Date : Dec-16
- Pages : 117
- Publisher : GlobalInfo Research
Multilayer printed-wiring boards are made from the same base material with copper foil on the top & bottom and one or more?inner layer?cores. The number of ?layers? corresponds to the number of copper foil layers. Scope of the Report: This report focuses on the Multilayer Printed-wiring Board in Global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application. Market Segment by Manufacturers, this report covers Nippon Mektron Zhen Ding Technology Unimicron Young Poong Group Samsung Electro-Mechanics Ibiden Tripod TTM Technologies Sumitomo Electric SEI Daeduck Group Nanya PCB Compeq HannStar Board LG Innotek AT&S Meiko Chin-Poon Shennan WUS Market Segment by Regions, regional analysis covers North America (USA, Canada and Mexico) Europe (Germany, France, UK, Russia and Italy) Asia-Pacific (China, Japan, Korea, India and Southeast Asia) South America, Middle East and Africa Market Segment by Type, covers Layer 4~6 Layer 8~10 Layer 10+ Market Segment by Applications, can be divided into Consumer electronics Communications Computer related industry Automotive industry Others There are 13 Chapters to deeply display the global Multilayer Printed-wiring Board market. Chapter 1, to describe Multilayer Printed-wiring Board Introduction, product scope, market overview, market opportunities, market risk, market driving force; Chapter 2, to analyze the top manufacturers of Multilayer Printed-wiring Board, with sales, revenue, and price of Multilayer Printed-wiring Board, in 2015 and 2016; Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2015 and 2016; Chapter 4, to show the global market by regions, with sales, revenue and market share of Multilayer Printed-wiring Board, for each region, from 2011 to 2016; Chapter 5, 6, 7 and 8, to analyze the key regions, with sales, revenue and market share by key countries in these regions; Chapter 9 and 10, to show the market by type and application, with sales market share and growth rate by type, application, from 2011 to 2016; Chapter 11, Multilayer Printed-wiring Board market forecast, by regions, type and application, with sales and revenue, from 2016 to 2021; Chapter 12 and 13, to describe Multilayer Printed-wiring Board sales channel, distributors, traders, dealers, appendix and data source.