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Global Multilayer Printed-wiring Board Market by Manufacturers, Regions, Type and Application, Forecast to 2021

  • Id : RNR-44277
  • Category : Semiconductor Electronics
  • Publish Date : Dec-16
  • Pages : 117
  • Publisher : GlobalInfo Research
License Type

Description
Multilayer printed-wiring boards are made from the same base material with copper foil on the top & bottom and one or more?inner layer?cores. The number of ?layers? corresponds to the number of copper foil layers.

Scope of the Report:
This report focuses on the Multilayer Printed-wiring Board in Global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

Market Segment by Manufacturers, this report covers
    Nippon Mektron
    Zhen Ding Technology
    Unimicron
    Young Poong Group
    Samsung Electro-Mechanics
    Ibiden
    Tripod
    TTM Technologies
    Sumitomo Electric SEI
    Daeduck Group
    Nanya PCB
    Compeq
    HannStar Board
    LG Innotek
    AT&S
    Meiko
    Chin-Poon
    Shennan
    WUS

Market Segment by Regions, regional analysis covers
North America (USA, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America, Middle East and Africa

Market Segment by Type, covers
    Layer 4~6 
    Layer 8~10
    Layer 10+

Market Segment by Applications, can be divided into
    Consumer electronics 
    Communications
    Computer related industry
    Automotive industry
    Others

There are 13 Chapters to deeply display the global Multilayer Printed-wiring Board market.

Chapter 1, to describe Multilayer Printed-wiring Board Introduction, product scope, market overview, market opportunities, market risk, market driving force;

Chapter 2, to analyze the top manufacturers of Multilayer Printed-wiring Board, with sales, revenue, and price of Multilayer Printed-wiring Board, in 2015 and 2016;

Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2015 and 2016;

Chapter 4, to show the global market by regions, with sales, revenue and market share of Multilayer Printed-wiring Board, for each region, from 2011 to 2016;

Chapter 5, 6, 7 and 8, to analyze the key regions, with sales, revenue and market share by key countries in these regions;

Chapter 9 and 10, to show the market by type and application, with sales market share and growth rate by type, application, from 2011 to 2016;

Chapter 11, Multilayer Printed-wiring Board market forecast, by regions, type and application, with sales and revenue, from 2016 to 2021;

Chapter 12 and 13, to describe Multilayer Printed-wiring Board sales channel, distributors, traders, dealers, appendix and data source.
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