Home / Semiconductor Electronics / Global Thick-film Hybrid Integrated Circuit Market Professional Survey Report 2016

Global Thick-film Hybrid Integrated Circuit Market Professional Survey Report 2016

  • Id : RNR-3059
  • Category : Semiconductor Electronics
  • Publish Date : 20/Jun
  • Pages : 108
  • Format : PDF
License Type

Description
This report mainly covers the following
Product types including
    96% Al2O3 Ceramic Substrate Thick-Film Hybrid Integrated Circuit
    BeO Ceramic Substrate Thick-Film Hybrid Integrated Circuit
    AIN Based Thick-Film Hybrid Integrated Circuit
    Other Substrates
The segment applications including
    Avionics and Defense
    Automotive
    Telecoms and Computer Industry
    Consumer Electrons
    Other Applications
Segment regions including (the separated region report can also be offered)
    North America
    Europe
    Japan
    China
    Southeast Asia
    India
The players list (Partly, Players you are interested in can also be added)
    Crane Interpoint
    VPT(HEICO)
    MDI
    MSK(Anaren)
    IR(Infineon)
    GE
    Techngraph
    AUREL s.p.a.
    Cermetek
    JRM
    Siegert
    ISSI
    Custom Interconnect
    Midas
    ACT
    E-TekNet
    Integrated Technology Lab
    CSIMC
    Zhenhua
    JEC
    Sevenstar
    Fenghua
    CETC
With 23 top producers.

Data including (both global and regions): Market Size (both volume - Unit and value - million USD), Market Share, Production data, Consumption data, Trade data, Price - USD/Unit, Cost, Gross margin etc.

More detailed information, please refer to the attachment file and table of contents. If you have other requirements, please contact us, we can also offer!