Home / Semiconductor Electronics / United States IC Packaging Market Report 2016

United States IC Packaging Market Report 2016

  • Id : RNR-27049
  • Category : Semiconductor Electronics
  • Publish Date : 17-Oct
  • Pages : 122
  • Format : PDF
License Type

Description
Notes:
Sales, means the sales volume of IC Packaging
Revenue, means the sales value of IC Packaging

This report studies sales (consumption) of IC Packaging in United States market, focuses on the top players, with sales, price, revenue and market share for each player, covering
    ASE
    Amkor
    SPIL
    STATS ChipPac
    Powertech Technology
    J-devices
    UTAC
    JECT
    ChipMOS
    Chipbond
    KYEC
    STS Semiconductor
    Huatian
    Carsem
    Nepes
    FATC
    Walton
    Unisem
    NantongFujitsu Microelectronics
    Hana Micron
    Signetics
    LINGSEN

Split by product types, with sales, revenue, price, market share and growth rate of each type, can be divided into
    Type I
    Type II
    Type III
Split by applications, this report focuses on sales, market share and growth rate of  IC Packaging in each application, can be divided into
    CIS
    MEMS
    Others